| PART |
Description |
Maker |
| IL3M-HX5F12.5-32.768 |
4 Pad Plastic Package Quartz Crystal, 3.8 mm x 8 mm
|
ILSI America LLC
|
| IL3S-HJ9F18-20.000 IL3S-JH9F18-20.000 IL3S-BI9F18- |
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
4 Pad Plastic Package Quartz Crystal, 4.6 mm x 12.5 mm
|
ILSI America LLC
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| ILCX05-BB0318-20.000 ILCX05-BB1318-20.000 ILCX05-B |
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
|
ILSI America LLC
|
| 21-0108 |
PACKAGE OUTLINE, TSSOP 4.4MM BODY, EXPOSED PAD
|
Maxim Integrated Products
|
| P2NQ |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ILCX13-GHD318-20.000 ILCX13-GHDF18-20.000 ILCX13-B |
4 Pad Ceramic Package, 2.5 mm x 3.2 mm
4 Pad Ceramic Package, 2.5 mm x 3.2 mm
|
ILSI America LLC
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| M24.173B |
Thin Shrink Small Outline Wxposed Pad Plastic Packages ( EPTSSOP) 薄小外形Wxposed垫塑料封装（EPTSSOP
From old datasheet system
|
INTERSIL[Intersil Corporation]
|
